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A close-up SEM image of the silicon chip and gold beam leads. The sample stage is tilted 60 degrees in this image. Chip thickness is 1.8um and gold thickness is 2.4um. The manufactured thickness of the silicon is 3um +/- 0.5um; the silicon was thinned during the last minutes of the silicon etch after the BOX masking layer wore away. Target thickness for the gold is 2.5um. |
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Last Updated July 7th, 2003
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